英特尔投资3亿美元在中国建立芯片封装和测试工厂

Intel invests US$300 million in China chip packaging and testing plant英特尔投资3亿美元在中国建立芯片封装和测试工厂

US semiconductor giant Intel said it would expand its chip packaging and testing base in Chengdu, in a show of commitment to the mainland market despite a recent call by a Beijing-backed cybersecurity group to review the company’s products.美国半导体巨头英特尔表示，将扩大其在成都的芯片封装和测试基地，显示出尽管北京支持的一个网络安全组织最近呼吁审查该公司的产品，英特尔仍然致力于中国大陆市场。

In addition to enlarging packaging and testing capacity for server chips, the facility will also establish a “customer solutions centre to improve the efficiency of the local supply chain, increase support for Chinese customers and improve response time”, Intel China said on Monday on its WeChat account.英特尔中国周一在其微信公众号上表示，除了扩大服务器芯片的封装和测试产能外，该设施还将设立一个“客户解决方案中心，以提高本地供应链的效率，加强对中国客户的支持并提升响应速度”。

英特尔